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New Cutting Solutions

LPT has recently acquired custom equipment with improved, state of the art, high speed laser cutting technology.  Markets keep demanding that features become smaller and closer together. With our new laser capability, LPT can provide leading edge technology to accommodate these demands to the great benefit of our customers.

The new laser technology allows higher cutting speeds without sacrificing quality.  This equipment was custom fabricated for LPT to not only produce parts at higher speeds but to improve quality and allow features to be spaced more closely, a 4X benefit as explained below:

A cutting laser beam is not perfectly cylindrical but, being focused, has a cone shape that produces a taper on the cut edges of the material. Thus, the dimensions on the entrance side are slightly larger than on the exit side. This is doubly true for holes. (Dimensions are normally specified for the exit side.)  With the previous laser technology, the taper was typically 2°, and design guidelines for holes would allow up to 0.001" of taper per 0.010" of thickness. For example, a hole in 0.030” thick hard material (such as ceramic or metal) could differ in dimensions between the entrance and exit sides by as much as 0.003”. With the new laser technology this difference has been reduced by 50%. The photos below show the laser entrance and exit sides drilled with the new equipment.

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laser cutting, laser processing, laser technologies, laser machining, ceramic laser cutting, ceramic laser machining, laser machining, laser processing
0.001" thick Kapton. webs are 0.003" between cutouts

0.040" thick black ceramic
webs are 0.005" wide

0.020" thick 96% alumina. webs are 0.010" thick with no signs of microfracturing
or stress

Normally, design guidelines limit feature spacing to be equal to material thickness, a   1:1 ratio. With the new laser system, we can space features at half the material thickness, a ratio of 0.5:1. How can we achieve a 50% improvement without creating micro-fractures?

With the new laser technology, the “heat-affected” zone (HAZ) and the taper inherent in the laser machining process have been significantly reduced.   The HAZ is an area around the laser entrance side of the feature that has a thin layer (approximately 0.0005” to 0.001” wide) of excess material removed while the laser is cutting the material.  HAZ limits how closely thin and thick film metallization can be deposited around the features. In addition, it limits the spacing between features on other materials such as laminates, Kapton, metal foils, plastics and other exotic materials. Now these limitations have been improved by 50%.

  • Another benefit of reduced HAZ is that the scribe pulses can also be produced using a tighter gap between them.  The benefit is that smaller and cleaner pulses can be produced allowing more uniform snapping of the substrate.

  • Reduction of the HAZ by 50% allowing closer spacing plus a 50% decrease in taper is a 4X improvement for the customer; only from LPT

 

Download our
New Cutting Solutions
Datasheet >
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CAPABILITIES
At A Glance . . ..

Over 50 years of technical expertise

High Precision, High Quality, High Volume Applications

500 Watts CO2 Laser Systems with multiple heads that scribe and drill over a 17" workspace

Diamond Sawing

High purity ceramics (96%, 99%, Al2O3), plastics, metals and other exotic materials

Ability to import CAD Data in nearly any format

Quality Assurance provides for process inspection from start to finish

 © 1992, Laser Processing Technology, Inc    ∙   12021 N. E. Airport Way, Suite C, Portland, OR 97220   ∙   (503) 254-2761    Sales@LPT-Inc.com
Laser Machining, Laser Drilling, Laser Scribing, Laser Marking, Precision Sawing, Annealing, Coating